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The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 2,   Pages 238-241 doi: 10.1007/s11465-006-0011-5

Abstract: indicate that the sensor presented better performances and that the bonding techniques can be used in MEMSpackaging.

Keywords： Si/Au-glass     strength     MEMS packaging     process     sandwich structure    

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Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Strategic Study of CAE 2002, Volume 4, Issue 6,   Pages 56-62

Abstract:

The packaging of micro electro mechanical systems (MEMS) is referred to first-level packaging andThe very high importance not to forget packaging at the beginning of a project, when hoping to industrializeMEMS is discussed.

Keywords： packaging of MEMS     bulk silicon bonding technology     film-sealed technology    

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Special issue: Micro-electromechanical systems (MEMS)

Zhuangde JIANG

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 457-458 doi: 10.1007/s11465-017-0492-4

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Anthocyanins/chitosan films doped by nano zinc oxide for active and intelligent packaging: comparison

Frontiers of Chemical Science and Engineering 2023, Volume 17, Issue 6,   Pages 704-715 doi: 10.1007/s11705-022-2270-z

Abstract: from dark green to brown, indicating the potential for applications in active and intelligent food packaging

Keywords： bio-based     multifunction     colorimetric indicator     active and intelligent packaging    

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ENVIRONMENTAL ATTITUDES AND CONSUMER PREFERENCE FOR ENVIRONMENTALLY-FRIENDLY BEVERAGE PACKAGING: THE

Frontiers of Agricultural Science and Engineering 2023, Volume 10, Issue 1,   Pages 95-108 doi: 10.15302/J-FASE-2022478

Abstract:

● Consumer preference for environmentally-friendly beverage packaging

Keywords： China     consumer preference     food and beverage packaging     green identity label     information treatment    

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Additive direct-write microfabrication for MEMS: A review

Kwok Siong TEH

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 490-509 doi: 10.1007/s11465-017-0484-4

Abstract: barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMSachieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMSCompared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, enable faster design-to-product cycle, empower new paradigms in MEMS designs, and critically, encouragewider participation in MEMS research at institutions or for individuals with limited or no access to

Keywords： direct-write     additive manufacturing     microfabrication     MEMS    

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Review of MEMS differential scanning calorimetry for biomolecular study

Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 526-538 doi: 10.1007/s11465-017-0451-0

Abstract: We also introduce the recent advances of the development of micro-electro-mechanic-system (MEMS) based

Keywords： differential scanning calorimetry     biomolecule     MEMS     thermodynamic    

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Thermal and catalytic pyrolysis of a synthetic mixture representative of packaging plastics residue

Simona Colantonio, Lorenzo Cafiero, Doina De Angelis, Nicolò M. Ippolito, Riccardo Tuffi, Stefano Vecchio Ciprioti

Frontiers of Chemical Science and Engineering 2020, Volume 14, Issue 2,   Pages 288-303 doi: 10.1007/s11705-019-1875-3

Abstract: A synthetic mixture of real waste packaging plastics representative of the residue from a material recovery

Keywords： packaging plastics waste     plasmix     pyrolysis     zeolite catalyst     degradation temperature    

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MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 557-566 doi: 10.1007/s11465-017-0441-2

Abstract:

In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensorsThis paper presents a review of MEMS-based thermoelectric IR sensors.second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging

Keywords： thermoelectric infrared sensor     CMOS-MEMS     thermopile     micromachining     wafer-level package    

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A bionic approach for the mechanical and electrical decoupling of an MEMS capacitive sensor in ultralow

Frontiers of Mechanical Engineering 2023, Volume 18, Issue 2, doi: 10.1007/s11465-023-0747-1

Abstract: Capacitive sensors are efficient tools for biophysical force measurement, which is essential for the exploration of cellular behavior. However, attention has been rarely given on the influences of external mechanical and internal electrical interferences on capacitive sensors. In this work, a bionic swallow structure design norm was developed for mechanical decoupling, and the influences of structural parameters on mechanical behavior were fully analyzed and optimized. A bionic feather comb distribution strategy and a portable readout circuit were proposed for eliminating electrostatic interferences. Electrostatic instability was evaluated, and electrostatic decoupling performance was verified on the basis of a novel measurement method utilizing four complementary comb arrays and application-specific integrated circuit readouts. An electrostatic pulling experiment showed that the bionic swallow structure hardly moved by 0.770 nm, and the measurement error was less than 0.009% for the area-variant sensor and 1.118% for the gap-variant sensor, which can be easily compensated in readouts. The proposed sensor also exhibited high resistance against electrostatic rotation, and the resulting measurement error dropped below 0.751%. The rotation interferences were less than 0.330 nm and (1.829 × 10−7)°, which were 35 times smaller than those of the traditional differential one. Based on the proposed bionic decoupling method, the fabricated sensor exhibited overwhelming capacitive sensitivity values of 7.078 and 1.473 pF/µm for gap-variant and area-variant devices, respectively, which were the highest among the current devices. High immunity to mechanical disturbances was maintained simultaneously, i.e., less than 0.369% and 0.058% of the sensor outputs for the gap-variant and area-variant devices, respectively, indicating its great performance improvements over existing devices and feasibility in ultralow biomedical force measurement.

Keywords： micro-electro-mechanical system capacitive sensor     bionics     operation instability     mechanical and electrical decoupling     biomedical force measurement    

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Research of MEMS and Development of One-chip RF - MEMS

Zhong Xianxin,Yu Wenge,Li Xiaoyi,Wu Zhengzhong,Liu Jixue,Chen Shuai,Shao Xiaoliang

Strategic Study of CAE 2004, Volume 6, Issue 7,   Pages 21-25

Abstract: The significance of MEMS and its basic theory are expounded in this paper.Performances of MEMS devices used in wireless communication are summarized, and then a proposition thatMEMS technology is one of the ultimate resolutions for one-chip wireless communication equipment is

Keywords： microsystem     integration     one-chip     wireless communication system    

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combined modulated feedback and temperature compensation approach to improve bias drift of a closed-loop MEMS

Ming-jun MA,Zhong-he JIN,Hui-jie ZHU

Frontiers of Information Technology & Electronic Engineering 2015, Volume 16, Issue 6,   Pages 497-510 doi: 10.1631/FITEE.1400349

Abstract: The bias drift of a micro-electro-mechanical systems (MEMS) accelerometer suffers from the 1/ noise

Keywords： Bias drift     Closed-loop MEMS accelerometer     Modulated feedback approach     Temperature compensation    

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Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs) Research Article

Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI,zhenfang@std.uestc.edu.cn,jhzhang@uestc.edu.cn

Frontiers of Information Technology & Electronic Engineering 2023, Volume 24, Issue 6,   Pages 916-926 doi: 10.1631/FITEE.2200573

Abstract: design of Ka-band (33 GHz) that features broadband and great filtering response, and is based on glass packagingCompared to traditional packaging materials (printed circuit board, low temperature co-fired ceramic,Si, etc.), TGVs are more suitable for miniaturization (millimeter-wave three-dimensional (3D) packaging

Keywords： Filtering packaging antenna (FPA)     Through-glass vias (TGVs)     3D packaging devices     Laser bonding    

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Development and application of high-end aerospace MEMS

Weizheng YUAN

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 567-573 doi: 10.1007/s11465-017-0424-3

Abstract: paper introduces the design and manufacturing technology of aerospace microelectromechanical systems (MEMSMoreover, several kinds of special MEMS devices with high precision, high reliability, and environmental

Keywords： MEMS     design and manufacture technology     aeronautic and aerospace    

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The road to sustainable use and waste management of plastics in Portugal

Frontiers of Environmental Science & Engineering 2022, Volume 16, Issue 1,   Pages 5-5 doi: 10.1007/s11783-021-1439-x

Abstract:

• Portugal recycles 34% of the 40 kg/hab year of plastic packaging waste

Keywords： Single-use plastics     Plastic packaging     Plastic waste     Waste management     Waste shipment     Lightweight    

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Title Author Date Type Operation

The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Journal Article

Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Journal Article

Special issue: Micro-electromechanical systems (MEMS)

Zhuangde JIANG

Journal Article

Anthocyanins/chitosan films doped by nano zinc oxide for active and intelligent packaging: comparison

Journal Article

ENVIRONMENTAL ATTITUDES AND CONSUMER PREFERENCE FOR ENVIRONMENTALLY-FRIENDLY BEVERAGE PACKAGING: THE

Journal Article

Additive direct-write microfabrication for MEMS: A review

Kwok Siong TEH

Journal Article

Review of MEMS differential scanning calorimetry for biomolecular study

Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO

Journal Article

Thermal and catalytic pyrolysis of a synthetic mixture representative of packaging plastics residue

Simona Colantonio, Lorenzo Cafiero, Doina De Angelis, Nicolò M. Ippolito, Riccardo Tuffi, Stefano Vecchio Ciprioti

Journal Article

MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

Journal Article

A bionic approach for the mechanical and electrical decoupling of an MEMS capacitive sensor in ultralow

Journal Article

Research of MEMS and Development of One-chip RF - MEMS

Zhong Xianxin,Yu Wenge,Li Xiaoyi,Wu Zhengzhong,Liu Jixue,Chen Shuai,Shao Xiaoliang

Journal Article

combined modulated feedback and temperature compensation approach to improve bias drift of a closed-loop MEMS

Ming-jun MA,Zhong-he JIN,Hui-jie ZHU

Journal Article

Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)

Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI,zhenfang@std.uestc.edu.cn,jhzhang@uestc.edu.cn

Journal Article

Development and application of high-end aerospace MEMS

Weizheng YUAN

Journal Article

The road to sustainable use and waste management of plastics in Portugal

Journal Article